Not sure what your application requires or what kind of bonding is sufficient, but there's been a lot of success with diffusion bonding and wafer fusion. For diffusion bonding, thin InGaAs or InGaP layers on the two GaAs wafers are held at low temperature to diffuse the In atoms to form the bond. Wafer fusion doesn't require additional layers but uses much higher temperatures to form atomic bonds. Here are two papers:
Angie
On Nov 2, 2012, at 2:18 PM, arka majumdar wrote:
HiDoes anyone know whether we can bond one GaAs wafer to another GaAs wafer? What is the surface quality of such bonding? Please let me knowThanksArka--
Best,
Arka
______________________________________________
Arka Majumdar, PMP, PhD
Postdoc Scholar, UC Berkeley
www.stanford.edu/~arkam
Phone: 6509068666
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