Recipe "HDP-SiO2"
We ran 6 wafers targeting 5000 A, 2 before a chamber plasma clean, 4 after. Measurements this run were 55 pt Woollam.
The dep rate and uniformity continue to be ~1%. The current dep rate estimate is 27.66 A/sec, consistent with previous values of
27.72 and 27.58. Remember to include the 6 sec of "strike" in the rate calculations
The 1st wafer after the clean was 0.68% thicker than the averages (= 2 sigma of wafer avgs, nearly a significant difference).
Those few interested in this spreadsheet, please ask.
Douglas Tham participated in the depositions and measurements.
Thanks to Jim McVittie, Nancy and Elmer, and to SNF for a marvelous new tool.
Also to Ed Myers for the Woollam, making these measurements possible.
jim
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