Seminar on Semiconductor Packaging and 3D ICs

Semiconductor Packaging and 3D ICs

Speaker: Jan Vardaman, Founder and President, Techsearch

Time: 4:15-5:30pm

Date : Wednesday, 10/31/2012 @ CIS-X 101

Abstract
In the last decade, advanced packaging has emerged as an enabler of today's electronic products. The impact of packaging, assembly, and test is increasingly felt in the semiconductor industry and package selection is important to the success of the end product.

While the drivers for 3D ICs remain performance and form factor, the time line for its adoption keeps shifting out into the future. Several technical challenges and infrastructure issues such as business logistics are delaying the full commercialization of TSV technology for 3D ICs. Until these issues can be resolved, alternative packages will be the choice for high volume manufacturing. Once the 3D IC technical challenges are resolved and the technology becomes cost-effective, business challenges will remain until the industry settles on a model.

This presentation provides an introduction into trends in semiconductor packaging and insight into technology and business challenges in the adoption of new technologies.

Speaker Bio
E. Jan Vardaman is president and founder of TechSearch International, Inc., which has provided analysis on technology and market trends in semiconductor packaging since 1987. She is co-author of How to Make IC Packages (published in Japanese by Nikkan Kogyo Shinbunsha), a columnist with Circuits Assembly Magazine, and the author of numerous publications on microelectronics market and technology trends. TechSearch International has published detailed analysis of the business and technology issues in the adoption of 3D ICs. She is a member of IEEE CPMT, IMAPS, IPC, MEPTEC, and SEMI. She was elected to two terms on the IEEE CPMT Board of Governors. Before founding TechSearch International, she served on the corporate staff of Microelectronics and Computer Technology Corporation (MCC), the electronics industry's first pre-competitive research consortium.