Good results for HD_SiO2.
I find that the uniformity and reproducibility of rate and index are all better than 1%
I also find that Nanospec(5 pt) and Woollam(9 pt) averages agree to better than 1%
The key to predicting thickness is adding the 6 seconds of the "Light" step to the total deposition time.
I included data from thickness' 56 nm to 677 nm and from factory and site acceptance as well as depositions logged by "wslee" and my own 3 depositions.
The rate for HD_SiO2 is 27.58 A/sec, +/- 1%. Remember to account for the 6 seconds of strike.
If interested, I can e-mail my spreadsheet.
Please log your results and send me your data for "HD_SiO2". Send dry etch, and especially wet etch rates as well.
Any one interested in a recipe for lower rate for control of thinner films? I predict (10.3 + 6) seconds for a 450 Ang. film.
jimkruger
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