Also Big thanks to Jim Mcvitte for all the effort installing and bringing up the tool.
Attached is the SIMS from Applied Materials, indicating that no metal or other contamination in the chamber.
I am pretty surprised given that it is a low temp tool and contaminated tool.
Also attached is also the AFM roughness Images for the tool on SiNx and SiOx for 1000A.
Enjoy
Pradeep
On Fri, Dec 7, 2012 at 12:02 PM, jim kruger <jimkruger@yahoo.com> wrote:
Good results for HD_SiO2.I find that the uniformity and reproducibility of rate and index are all better than 1%
I also find that Nanospec(5 pt) and Woollam(9 pt) averages agree to better than 1%
The key to predicting thickness is adding the 6 seconds of the "Light" step to the total deposition time.
I included data from thickness' 56 nm to 677 nm and from factory and site acceptance as well as depositions logged by "wslee" and my own 3 depositions.
The rate for HD_SiO2 is 27.58 A/sec, +/- 1%. Remember to account for the 6 seconds of strike.
If interested, I can e-mail my spreadsheet.
Please log your results and send me your data for "HD_SiO2". Send dry etch, and especially wet etch rates as well.
Any one interested in a recipe for lower rate for control of thinner films? I predict (10.3 + 6) seconds for a 450 Ang. film.
jimkruger
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